Wafer Materials & Sizes: Our cleanroom processes
primarily silicon substrates, although we also have experience with silicon on sapphire,
quartz, compound semiconductors and other less common materials. The wafer size
for which we have the most equipment is 4", but we also process wafers from 3" to
8". Wafer thickness vary from 200 micron to 1 mm substrates. Some clients utilize
other materials such as piezoelectrics, polymers, and photonic materials.
Cleanroom Class:
Lab cleanroom is certified Class 10,000
Processes which can be run in the microfab Lab include
oxidation, doping, annealing, and curing. A variety of metals can be sputtered or
evaporated. LPCVD nitride and oxide are available. A new PECVD system provides lab
users with oxynitride and other custom thin films.
Photolithography tools include the HMDS oven, spin
coaters contact aligners, bake ovens, and a develop station. Other wet benches provide
cleaning (e.g., Nanostrip, SC1, SC2, BOE, piranha) and etching (e.g., HF, KOH, HNA,
EDP, TFA gold etch) both isotropic and anisotropic.
Plasma etching of nitride and silicon is available,
including the Bosch Process. A full set of characterization and testing equipment
can be used, including KLA-Tencor P15, Nanospec Interferometer, ellipsometer, four
point probe, Alphastep, Biorad and electrical testers.
SEM and EDX equipment and services are available
at the WTC within the Microfab Lab
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Tool Bench
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